Electroplating Stations - For Wafer/Substrate - Copper wiring / electrode / Solder / Magnetic alloy

Not just equipment, but also processes. We are a proposal-based plating equipment manufacturer.

Electro/E-less Plating Stations

Product Line-up

Tosetz can propose the best type of plating station and process regardless of any chemical solutions. Most of our plating stations are one and only spec for customer’s requests and purpose. Based on your performance, throughput, and specifications, we will propose the most suitable method from face-up type, face-down type, and vertical dip type.

We not only have Max. 12 inch mass production plating equipment, but also desktop, manual, and semi-automatic plating tool for research and development/prototyping. We will propose the plating tool that suits your purpose and budget, such as research and development of plating processes, prototyping of new products, and small-scale production.

Face-up two-tank fully automatic plating equipment 1.png

T EAM-FU

Automated Face-up Plating Tool

Face-up Type

HDD Magnetic head, Magnetic sensor ( NiFe alloy such as Permalloy, Invar and FeCo/NiFeCo alloy)
Electrode, wiring process such as TSV, RDL,

μ-Bump in advanced packaging

■　Features

・　Excellent thickness uniformity

・　Excellent alloy composition stability

・　Measures against highly corrosive plating film

・　Cassette to cassette

■　Plating material

・　Magnetic alloy, Cu , Ni, Au, SnAg, Rh, etc.

・　Cu/Ni/St-Au/Au multi-layer

■　Wafer size

・　4、6、8、12 inch

Face-down type

Electrode, wiring process such as micro-bump

■　Features

・　Small footprint

・　Cassette to cassette

■　Plating material

・　Cu、Ni、Au

・　Cu/Ni/St-Au/Au multi-layer

■　Wafer size

・　4、6、8 inch

Face-down 6-tank fully automatic plating equipment.png

T EAM-FD

Automated Face-down Plating Tool

T ESM-VT

Semi-Automated Vertical Dip Plating Tool

Vertical Dip Type

Electrodes and wiring processes

for electronic devices
Fine wiring in advanced packaging

■　Features

・　Small footprint

・　Square board, large board available

・　Easy to change wafer/substrate size and mixed processing

■　Plating material

・　Cu、Ni、Au

■　Wafer/substrate size

・　4、6、8、12 inch wafer

・　Rectangle(Rigid, Flexible)

R &D Tools

Desktop, Manual, Semi-AutomatedPlating Tool

R&D/Prototype use
Desktop/Manual/

Semi-Automatic Plating Tool

■　Features

・　Desktop type: Face-up, Vertical dip

・　Semi-automatic type: Face-up

・　Manual type: Vertical dip

■　Plating material

・　Magnetic alloy, Cu, Ni, Au, Ag, Rh, SnAg, etc.

■　Wafer/Substrate size

・　4、6、8、12 inch wafer

・　Rectangle(Rigid, Flexible)

No.1 share in magnetic thin film electroplating for

all HDD manufacturers
Electroplating of all compositions of magnetic alloys.

1．Knowledge of plating solution composition and plating conditions

for all compositions.

2．We can deposit thin films of Permalloy, Invar and any other composition

of binary and ternary alloys of Ni, Fe, Co.

3．We can make proposals based on the various characteristics required

for our customer's electronic device products

(characteristics/composition/plating conditions)

4．Alloying with P, Mo, Pd, etc. is possible.

5．We can consult on methods for evaluating magnetic properties,

management methods during mass production, etc.

6．We also handle thick-film, low-stress Ni electroforming.

Tosetz Target Market for New Business

Based on the unique technology cultivated in the field of magnetic thin films for HDDs, which require strict film thickness and composition control on the nanometer scale, our products have been widely adopted in recent years for electroplating applications in the fields of small electronic components mounted on smartphones and tablets, advanced semiconductor packaging, MEMS, and sensors.

Inquiries are increasing for copper fine wiring such as TSV, Cu pillar, RDL, SnAg, and indium microbumps, for wafer and substrate manufacturing processes in various electronic device fields, including 3D-IC, chiplets, FO-WLP/PLP, IoT sensors, power devices, and probe cards.